课程安排如下：

Module A: IC Design Engineering

Module Code:              E&I4453

Key Content Area:

1. INTRODUCTION

    - Basic Technology -IC

      Design Flow

2. IC TECHNOLOGIES AND TREND

    - Scales of integration

    - Full Custom Integrated Circuit, Standard Cell, Gate Array, FPGA, PLD

    - Digital, analogue and mix-signal-CMOS verus other technologies

3. IC FABRICATION PROCESS

    - Wafer preparation, photolithography, doging (Diffusion, ion implantation),

      etching, oxidation, epitaxial growth, metallisation - CMOS PROCESS

4. IC LAYOUT

    - CMOS logic circuits

    - Stick diagram

    - Design rules and manufacturing - Floorplanning, placement and routing- Layout considerations

    - Layout extraction -Design-Rule-Checker (DRC)

    - Layout-Versus-Schematic-verification (LVS)

    - Electrical-Rule-Checker (ERC)

5. IC Testing

    - Basic IC testing procedure

    - Test Pattern Generation, ATPG

    - Fault models

    - Observability and Controllability

    - Fault Coverage and Simulation

- Introduction to Design for Testability

6. IC PACKAGING

    - Assembly process: Die sawing/scribing, die attach, die shear testing, lead bonding,

      device sealing, final device testing

    - Package types: DIP, Leadless, PGA, Flat packs, Metal Can

- Criteria for choosing package type

Module B: Digital IC Design

Module Code:              E&I3452

Key Content Area:

1. Combinational MOS Logic Circuits

    -Basic combinational MOS logic circuit building blocks.

    - Combinational logic circuit representation in hardware description language

    - Limitations of combinational logic circuits

2. Sequential MOS Logic

    - Basic sequential MOS logic circuit building blocks.

    - Sequential logic circuit representation in hardware description language

    - Limitations of sequential logic circuits

3. Digital IC Design Flow

    - Digital IC design automation flow

    - Automatic digital IC floor planning, placement and layout techniques

4. Design Considerations

    - Supply, ground, clock, critical paths and I/O buffers considerations

    - High speed digital circuit design techniques

    - Digital IC design practical examples and mini-projects

Module C: Analogue IC Design

Key Content Area:

1. INTRODUCTION TO ANALOGUE DESIGN FLOW

    - Notation and Terminology

    - Schematic capture, IC layout, Simulation, Extraction, Post-layout simulation

    - Simulations with different comers, tape-out

2. CMOS TECHNOLOGY

    - The MOS Transistor, Passive components

3. CMOS Device Modelling

    - Simple MOS model, small-signal MOS model

    - Spice Models, Spice Simulation

4. BASIC ANALOGUE BUILDING BLOCKS

    - MOS Switch, Current Sinks and sources

    - Current mirrors

    - Current and Voltage Reference

    - Bandgap Voltage Reference

5. ANALOGUE IC LAYOUT CONSIDERATIONS

    - Design rules, antenna effect, symmetry, reference distribution, passive

      devices, Interconnects, substrate coupling